Bergquist Hi-Flow 300P（HIFLOWTHF1600P）導(dǎo)熱絕緣相變化材料 材料生產(chǎn)商：美國貝格斯（BERGQUIST）公司研發(fā)產(chǎn)品 Hi-Flow 300P（HIFLOWTHF1600P）可供規(guī)格： 厚度： 0.102mm 0.11mm 0.127mm 片材mm*304.8 mm 卷材mm*76.2 m 持續(xù)使用溫度：150° 導(dǎo)熱系數(shù)：1.6W/m-K 熱阻： 0.13C-in2/W(25psi) 背膠： 單面帶壓敏膠/不帶膠 顏色：綠色 Hi-Flow 300P（HIFLOWTHF1600P）應(yīng)用材料特性： Hi-Flow 300P（HIFLOWTHF1600P）已被市場認可了的聚酰亞胺基材，很好的絕緣性能，良好的抗切割性能，此款材料在使用過程中需要注意事項：（HIFLOWTHF1600P）是一款相變化導(dǎo)熱絕緣片，不僅僅是導(dǎo)熱，而且是絕緣的。在市面上絕大部分的相變導(dǎo)熱片都是只導(dǎo)熱，不絕緣的。這款（HIFLOWTHF1600P）相變導(dǎo)熱片二者兼顧。此款材料的相變化溫度為：55攝氏度。所以在夏季使用的時候，需要特別注意需要低溫冷藏。 Hi-FlowP （HIFLOWTHF1600P）consists of a thermally conductive 55°C phase change compound coated on a thermally conductive polyimide film.The polyimide reinforcement makes the material easy to handle and the 55°C phase change temperature minimizes shipping and handling problems. Hi-FlowP achieves superior values in voltage breakdown and thermal performance when compared to its competition.The product is supplied on an easy release liner for exceptional handling in high volume manual assemblies. Hi-Flow 300P （HIFLOWTHF1600P）is designed for use as a thermal interface material between electronic power devices requiring electrical isolation to the heat sink. Bergquist suggests the use of spring clips to assure constant pressure with the interface and power source. Please refer to thermal performance data to determine nominal spring pressure for your application. Hi-Flow 300P（HIFLOWTHF1600P）材料說明： 在CPU或功率元器件和散熱器之間作為導(dǎo)熱界面，Hi-Flow相變化材料是導(dǎo)熱膏很好的替代物。材料在特定的相變化溫度下從固態(tài)變成液態(tài)，可以來確�？偟慕缑鏉櫇瘢瑹o溢出。與導(dǎo)熱膏比較，它無臟污，污染和麻煩。 Hi-Flow 300P（HIFLOWTHF1600P）典型應(yīng)用： 彈片/扣具安裝 獨立的功率半導(dǎo)體和模塊 Hi-Flow 300P（HIFLOWTHF1600P）技術(shù)優(yōu)勢分析： 和其他品牌同類產(chǎn)品相比較，Hi-Flow 300P（HIFLOWTHF1600P）在擊穿電壓和導(dǎo)熱性能上更勝一籌。該產(chǎn)品提供易撕離型紙，在大規(guī)模的人工裝配中特別便利。