TDK電容C3216X5R1A107M160AC
尺寸
|
長(zhǎng)度(L) |
-
3.20mm +0.30,-0.10mm
|
|
寬度(W) |
-
1.60mm +0.30,-0.10mm
|
|
厚度(T) |
-
1.60mm +0.30,-0.10mm
|
|
端子寬度(B) |
-
0.20mm Min.
|
|
端子間隔(G) |
-
1.00mm Min.
|
|
焊盤布局(PA) |
-
2.10mm to 2.50mm(Flow Soldering)
2.00mm to 2.40mm(Reflow Soldering)
|
|
焊盤布局(PB) |
-
1.10mm to 1.30mm(Flow Soldering)
1.00mm to 1.20mm(Reflow Soldering)
|
|
焊盤布局(PC) |
-
1.00mm to 1.30mm(Flow Soldering)
1.10mm to 1.60mm(Reflow Soldering)
|
電氣特性
|
電容 |
-
100μF ±20%
|
|
額定電壓 |
-
10VDC
|
|
溫度特性 |
-
X5R(±15%)
|
|
耗散因數(shù) (Max.) |
-
10%
|
|
絕緣電阻 (Min.) |
-
1MΩ
|
其他
|
溫度范圍 |
-
-55～85°C
|
|
焊接方法 |
-
流體
-
回流
|
|
AEC-Q200 |
-
NO
|
|
包裝形式 |
-
塑封編帶 (180mm卷筒)
|
|
包裝個(gè)數(shù) |
-
2000pcs
|
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